
Materials
Silicon, Quartz and Nickel.
Size
Diameter from 1" to 6". Stamps
can be cut into custom shapes upon request.
Thickness
<2mm
Lateral dimensions
The minimum lateral dimensions
depends on the density of the pattern, the polarity of the
stamp and the required etch depth. In some cases it is
possible to achieve structures between 10-20nm. In general
the limit is around 25nm.
Line edge roughness (LER)
The line edge roughness is
connected to the price. By increasing the current in the
EBL-system or shifting to a resist with a lower quality it
is possible to trade the quality of the stamp against the
price. Under normal conditions it is possible to reach a LER
below 4nm.